| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion of an upper electrode to a wiring layer and prevent or suppress the diffusion of Ti which constitutes the wiring layer from diffusing in a capacitance insulation film. SOLUTION: An upper electrode, formed on the top face of a capacitance- insulating ferroelectric film 23, comprise a first electrode 24 and second electrode 26 electrically connected to the first electrode 24 through a first through-hole of a first insulation film 25 formed on the top face thereof. This will not make contact Ti which constitutes a wiring layer 30 directly to the first electrode 24 made of Pt or the like, thereby avoiding diffusing Ti in a insulation film 23. |
