| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact structure of a substrate which has a small transmission loss at its connection part. SOLUTION: A 1st substrate 11 having a 1st signal line S11 and a 1st ground G11 is connected to a 2nd substrate 12 of a microstrip structure having a 2nd signal line S12 and a 2nd ground G12. Then both lines S11 and S12 are connected together by the signal line connection parts C11, C12 and B12, and both grounds G11 and G12 are connected together by the ground connection parts B11 and V11 via a via V12 of the substrate 12. The parts C11, C12, B12, B11 and V11 are arranged so that the locus length of the signal current is approximate to that of the ground current. |
