| 发明名称 |
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| 摘要 |
PURPOSE:To realize heightening of density of a printed board with a small number of layers by providing contact holes of different diameters, and pressing and fixing in the holes male-side large and small contacts of press-fit type which engage female connectors respectively in both faces and the reverse face of the board correspondingly to respective large and small diameter through-holes. CONSTITUTION:Contact holes of different diameters are provided in a multilayer printed board 4. A male side large contact 2 for large-diameter through-holes which engages a connector in both faces of the board 4 and a male side small contact 3 for small-diameter through-holes which engages the connector in a single face of the board 4 are both embedded in a housing 9 so as to form a male side connector 1. The connector 1 is pressed in and held to the printed board 4 on the reverse side of the board 4 and a female connector 7 mounted on the surface of another printed board 12 is inserted into the board 4 from the front side of the board 4 and a group of bar-shaped terminals provided on the front side of the contacts 2, 3 are guided to the contact window 10 of the connector 7 and are in electrical contact with a female contact 8 provided inside the connector 7. A wiring area is thus secured using the printed board having small layers and heightening of density is realized. |
| 申请公布号 |
JP2871781(B2) |
申请公布日期 |
1999.03.17 |
| 申请号 |
JP19900015208 |
申请日期 |
1990.01.24 |
| 申请人 |
NIPPON DENKI KK;NIPPON DENSHIN DENWA KK;HIROSE DENKI KK;PPONDA TSUSHIN KOGYO KK |
发明人 |
HARADA KATSUMI;NAGAFUJI TOSHIAKI;NAKANO KENICHI;YASUDA KEIICHI;HIGAKI SHIGEO;OONISHI KOJI |
| 分类号 |
H01R9/16;(IPC1-7):H01R23/68 |
主分类号 |
H01R9/16 |
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