发明名称 Lead frame for hollow plastic package
摘要 A lead frame for a hollow plastic package is constructed with a source lead, a pellet mounting portion provided at the central portion of the source lead and mounting a pellet, a lead gate and a drain gate symmetrically provided across the pellet mounting portion at the both sides thereof. Then, each lead is provided with substantially equilateral trapezoidal cut-off having the upper bottom and the lower bottom along the extending direction of the lead on a part of the lead, so that a lead bending portion is formed with a narrow part thereat.
申请公布号 US5883424(A) 申请公布日期 1999.03.16
申请号 US19970839337 申请日期 1997.04.18
申请人 NEC CORPORATION 发明人 TANAKA, JUNICHI
分类号 H01L23/48;H01L23/047;H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/48
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