| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element, capable of accurately making an optical fiber and the optical semiconductor element face each other, improving the efficiency of the transfer of light between the optical fiber and the optical semiconductor element and normally and stably operating the optical semiconductor element housed inside, over a long period of time. SOLUTION: This package is composed of a base body 1, provided with the mounting part 1a of an optical semiconductor element S on the upper surface center part and a frame part 2 for surrounding the mounting part la on an outer peripheral part, plural external lead terminals 4 and a cylindrical member 6 for fixing the optical fiber attached to the frame part 2, whose both ends are projected to the inside and outside of the frame part 2 and exposed surface is coated with a plating metal layer and a lid body 3 attached to the upper surface of the frame part 2 for closing the inner side of the frame part 2. In this case, the base body 1 provided with the frame part 2 is formed by transfer molding, the member 6 for fixing the optical fiber is integrally attached to the frame part 2 and a projected part A, for filling a part between the lower surface of the member 6 for fixing the optical fiber, and the upper surface of the base body 1 is formed on the inner side of the frame part 2.
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