| 摘要 |
PROBLEM TO BE SOLVED: To reduce less time which occurs in a washing process performed after a polishing process, by providing a measurement equipment for analyzing, before washing, defective state of a wafer, finished with the polishing process provided near an unloading cassette, caused in the polishing process. SOLUTION: A wafer allocated at a setting part 52 of a waiting stage 46 is transported and housed in an unloading cassette 56 by recursive wafer transportation action of an unloading robot arm 55. The wafer housed in the unloading cassette 56 is transported to an analysis position of a measurement equipment 54 by a robot arm 59, and is analyzed either by the measurement of thickness of the film on a wafer surface after a polishing process or by the measurement of the number of particles of specified size which are remaining on the wafer surface. Such wafer as judged as normal by the analytical process is housed in a normal waiting cassette 64, then submerged in a chemical washing equipment 42. |
