| 摘要 |
PROBLEM TO BE SOLVED: To improve the radiation efficiency of a package to avoid damaging a semiconductor due to the heat staying therein by roughening the surface of the package for the heat radiation. SOLUTION: The BGA semiconductor device has a chip 2 fixed to a substrate 1 and solder balls 5 on the substrate surface are made conductive to the chip through inner leads 4 by the wire bonding 3. On the substrate, a resin-molded package P is formed and has a rough surface M to increase the radiation area. Such rough surface M increases the package surface area enough to well radiate the heat staying in the package P. A Cu heat sink is adhered to the inner bottom of a recess to more improve the radiation efficiency. The heat sink may be contacted to the chip 2 on the substrate 1 to much radiate the heat staying in the chip 2. |
