A semiconductor comprises an LOC structure. A bonding pad (24) solely for receiving a signal is formed parallel to a perimeter on top in the middle of the said element-formation surface, a bonding pad (25) solely for transmitting a signal is formed around the periphery of the said element-formation surface, an inner lead (26) solely for receiving a signal has its tip positioned parallel to the perimeter on top in the middle of the said element-formation surface, an inner lead (27) solely for transmitting a signal has its tip positioned on top of the periphery of the said element-formation surface. <IMAGE>
