| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance an inner pattern in adhesion to an insulating layer so as to prevent the inner conductor pattern from separating from the insulating layer at the interface between them by a method wherein a copper foil-blanked pattern is provided inside an inner conductor pattern at positions corresponding to one or more part mounting pads. SOLUTION: An inner conductor pattern 3, an epoxy resin insulating layer 4, and an outermost pad 5 are provided to each side of an epoxy resin insulating board 2. A copper foil-blanked part 3a is formed through such a manner that a circular blanked pattern 6 is arranged in the inner conductor pattern 3 under a part where the pad 5 is formed when an inner circuit is formed. In the circular blanked pattern, the surface of the insulating board 2 exposed in the copper foil-blanked part 3a of the inner conductor pattern 3 of a multilayer printed wiring board 1 is very firmly bonded to the insulating layer 4 through a chemical crosslinking reaction which occurs between epoxy resins, so that the inner conductor pattern 3 and the insulating layer 4 can be prevented from separating from each other.</p> |
