Coupling contact structure for integrated circuit pack

摘要

The coupling contact structure (16) is connected to the pack (10) via several contact fields for the structure location, with a mould defining a required shape and relative position for several coupling contacts of the structure. After the mould is filled with a contact making material the contact structure is formed and is then positioned with the mould next to the integrated circuit pack such that each coupling contact is positioned next to a corresponding field (14) of the pack. Then the formed coupling contacts are applied to the corresponding contact fields of the pack.