发明名称 LAMINATED RESIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a laminated resin film adapted particularly to food packaging having satisfactory transparency, cold resistance, low temperature heat sealability, heat sealing strength, impact strength, and film operability. SOLUTION: An ethylene resin film molding by using ethylene-α-olefin copolymer having MFR of 0.1 to 50 g/10 min, density of 0.88 to 0.935 g/cm<3> , integrated elution amount of temperature rise elution fractionation(TREF) of 90% or more at 90 deg.C, and a thickness (Ia) of mean noncrystal part obtained from melting end temperature (Tm) obtained by differential scanning calorimetry(DSC) of 100 Angstrom or less is laminated at least on one surface of a propylene resin film obtained by orienting propylene resin having MFR of 0.01 to 10 g/10 min and content of ethylene orα-olefin of 0 to 10 wt.%.
申请公布号 JPH10315403(A) 申请公布日期 1998.12.02
申请号 JP19970129741 申请日期 1997.05.20
申请人 NIPPON PORIKEMU KK 发明人 SHICHIJO YOSHIKO
分类号 B65D65/40;B29C47/06;B29L9/00;B32B27/32;C08L23/10;C08L23/18;(IPC1-7):B32B27/32 主分类号 B65D65/40
代理机构 代理人
主权项
地址