| 摘要 |
<p>PROBLEM TO BE SOLVED: To ensure the joint of a pin which serves as an input/output terminal of sufficient strength, by a method wherein the base of a via structure connected to one of conductor layers of thin film structure is laminated directly on a board parent material, and the pin is secured onto the via structure. SOLUTION: Conductor layers 24a to 24f of a via structure 22 are formed corresponding to the conductor layers 18a to 18f together with them at the same time, where the conductor layers 24a to 24f are directly and separately laminated. The via structure 22 is provided without insulating layer interposed between the uppermost conductor layer 24a and a board parent material 12. The stepped part of the conductor layers 24a to 24f serves as the via structure, and the center flat of the conductor layers 24a to 24f is made to serve as a pad where a pin 16 is mounted. The uppermost conductor layer 24a is plated with nickel and gold. Moreover, the pin 16 is provided with a mounting seat 16a at its lower end, and the mounting seat 16a is soldered to the uppermost conductor layer 24a with solder 26. By this setup, the joint of a pin can be enhanced in strength, so that an electronic device of this constitution can be used in an environment where it is high in temperature and humidity.</p> |
