发明名称 CIRCUIT CONNECTING MATERIAL AND PRODUCTION OF CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain the subject material excellent in low-temperature curing property, having a pot life, inserted between mutually opposed circuit electrodes, pressurizing mutually opposed circuit electrodes to electrically connect between electrodes in pressurizing direction by including a curing agent, a radically polymerizable substance and electroconductive particles as essential components. SOLUTION: This circuit connecting material consists essentially of (A) a curing agent generating a free radical by heating, (B) a radical polymerizable substance and (C) electroconductive particles whose surface layer is composed of at least one kind of metal selected from gold, silver and a metal of platinum group. Furthermore, a temperature in 10 hr half life of the component A is >=40 deg.C and a temperature in 1 min half life of the component A is <=180 deg.C, and benzoyl peroxide, etc., is used as the component A and methyl acrylate, etc., is used as the component B and thickness of metal of surface layer is preferably 300Å.
申请公布号 JPH10273626(A) 申请公布日期 1998.10.13
申请号 JP19970079425 申请日期 1997.03.31
申请人 HITACHI CHEM CO LTD 发明人 FUJINAWA MITSUGI;WATANABE ITSUO;ARIFUKU MASAHIRO
分类号 C09C1/56;C09C1/62;C09C3/06;C09J4/00;C09J9/02;C09J201/00;H01B1/20;H01L21/60;H05K3/38;(IPC1-7):C09J4/00 主分类号 C09C1/56
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