Flip-chip connecting type semiconductor device

摘要

A plurality of bumps formed of low melting metal are disposed on the surface of the peripheral portion of a semiconductor substrate. Those bumps which are included in the above bumps and formed on each corner portion of the semiconductor chip are connected to a power supply wiring and a ground wiring used as a power supply wiring. The other bumps disposed in position other than the corner portions are connected to a signal wiring.