| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a viahole to be accurately formed using an alignment mark as an alignment reference. SOLUTION: An adhesive agent layer 15, a high-toughness resin film 17, and an electroless plating adhesive agent layer 16 are successively laminated in this sequence into an interlayer insulating layer 20, and the interlayer insulating film 20 is provided onto a core board 11 where an alignment mark 14 is previously formed. A through-hole 19 is provided in the high-toughness resin film 17 corresponding to the position of the alignment mark 14. An alignment process is carried out using the alignment mark 14 visible through the through- hole 19 as a reference. In this state, a viahole forming hole 21 is bored in the interlayer insulating layer 20 by laser irradiation.</p> |
