| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of defective products caused by the positional dislocation of a semiconductor chip by malfilling by the difference of the drift velocities of resins, or by a pressure generated by the speed difference, by forming flow cavities being in continuity with cavity sections directly by the use of the metal molds whose thickness in the cavity sections are large. SOLUTION: Cavities are formed by combining one metal mold 6 with the other metal mold, and a semiconductor drip 1 fixed to a lead frame 2 is put in the cavities of the metal molds. And a semiconductor device is manufactured by sealing the semiconductor chip 1 put in and a part of the lead frame 2, by a resin to be injected into the cavity sections. In such a manufacturing apparatus as that, the thickness of a cavity section formed in one metal mold 6 is made different from that of a cavity section formed in the other metal mold. Besides, flow cavities 9, 12, 14 being directly in continuity with the cavities are formed by the use of the metal molds 6 whose thicknesses in the cavity sections are larger are provided. |
