| 发明名称 |
Copper coating of printed circuit boards |
| 摘要 |
A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant.
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| 申请公布号 |
US5800859(A) |
申请公布日期 |
1998.09.01 |
| 申请号 |
US19950570442 |
申请日期 |
1995.12.11 |
| 申请人 |
PRICE, ANDREW DAVID;MCGRATH, PETER THOMAS |
发明人 |
PRICE, ANDREW DAVID;MCGRATH, PETER THOMAS |
| 分类号 |
B32B15/08;C23C22/16;C23C22/52;C23F1/18;H05K3/00;H05K3/38;H05K3/46;(IPC1-7):B05D5/12 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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