| 摘要 |
<p>PROBLEM TO BE SOLVED: To process a vacuum chuck of various shapes and to keep the flatness of a wafer with a high accuracy also in the use, which is easy to cause heat storage, of the chuck, by a method wherein a coating layer consisting of a conductive material, which comprises an aluminum nitride ceramics, is formed on the surface on the side, which should hold the wafer, of the chuck. SOLUTION: A rim 15 is formed on the periphery of a vacuum chuck 11 of a pin contact system and a multitude of protrusions 12 are formed on the inside of the chuck 11. A through hole 14 for exhaust is formed in the vacuum chuck 11 for wafer, and a nipple 17 is connected with the hole 14 at the exit of the hole 14. When a wafer 13 is placed on the chuck 11 and evacuation of the chuck 11 is performed via the hole 14, spacers 16 held between the wafer 13 and the chuck 11 are put in a decompressed state and the wafer 13 results in being held on the chuck 11. Moreover, a coating layer consisting of a conductive material, which comprises an aluminum nitride ceramics, is formed on the processed surface of the chuck 11.</p> |
