发明名称 PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed board wherein interconnections between circuit wirings formed on both surfaces of the printed board can be securely maintained regardless of the temperature change, etc. SOLUTION: A printed board is provided with an insulating substrate 4 with a through hole 6, a circuit wiring 1A formed on one surface of the substrate 4, a circuit wiring 1B formed on the other surface of the substrate 4, and a lead 3 for connecting a connecting portion 1a connected to the circuit wiring 1A to a connecting portion 1b connected to the circuit wiring 1B. The connecting portion 1a is provided with a plurality of tongues 2 covering at least a portion of the other open end of the through hole 6. The lead 3 is inserted into the through hole 6, and is held by the ends of a plurality of tongues 2 formed at the connecting portion 1a and the ends of a plurality of tongues 2 formed at the connecting portion 1b.
申请公布号 JPH10215047(A) 申请公布日期 1998.08.11
申请号 JP19970017101 申请日期 1997.01.30
申请人 NEC ENG LTD 发明人 KURUMISAWA YUUJI
分类号 H05K1/11;H05K3/32;H05K3/34;H05K3/40 主分类号 H05K1/11
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