Semiconductor housing with two interconnected coolers for high power chips

摘要

The housing encloses the leads on the semiconductor chip surface which are coupled to the chip by conductive wires. The chip, leads and wires are sealed in a mould section. Preferably the two coolers form an integral unit. On the semiconductor chip, may be fitted a third cooler with a flange on at least one edge section, which locates an away extending section. Part of the leads may be free on the casing outside. The first two coolers may be of metal or ceramics. The third cooler is located on the chip top-side.