METHOD AND MOLD OF RESIN SEALING,申请号JP19960304346-传众专利搜索

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发明名称	METHOD AND MOLD OF RESIN SEALING
摘要
申请公布号	JPH10138294(A)	申请公布日期	1998.05.26
申请号	JP19960304346	申请日期	1996.11.15
申请人	SONY CORP	发明人	ABE HIROSHI
分类号	B29C33/10;B29C45/02;B29C45/26;B29C45/34;H01L21/56;(IPC1-7):B29C45/26	主分类号	B29C33/10
代理机构		代理人
主权项
地址

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