| 摘要 |
A lead frame for a semiconductor device includes a base which is coated by a protective coating. The lead frame base is made of a ferrous material. The protective coating is made by sequentially electroplating a copper-containing layer, a silver-containing layer and a palladium-containing layer. Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable. It is also possible to use a layer of tin or a tin alloy in place of the silver layer.
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