| 摘要 |
A circuit board which is provided with: an insulating base (11) that is configured from a ceramic material; an electrode for sliding (12a) which is formed on a circuit surface (11f) with use of a paste material (12P) that contains a glass component and a sinterable metal; and an electrode for connection (12b) which is formed on the circuit surface (11f) together with the electrode for sliding (12a) with use of the same paste material (12P). In the circuit surface (11f), a region (Rfb) on which the electrode for connection (12b) is formed has a higher surface roughness degree than a region (Rfa) on which the electrode for sliding (12a) is formed. The electrode for connection (12b) contains a smaller glass component in the surface than the electrode for sliding (12a). |
