发明名称 MEASUREMENT APPARATUS OF WAFER MOVING
摘要 The wafer movement measuring device is constructed by the characteristic that a wafer movement measuring vernier(3)(4) having a box shape of a double structure made up of an interior box(7)(9) and an exterior box(8)910) is formed as a square box shape of the same size as that of the interior box(7)(9) within a space(1) on a reticle, and that the size for one exterior box(8)(10) of the left or right wafer movement measuring vernier(3)(4) is formed more largely than that for another exterior box.
申请公布号 KR0123058(B1) 申请公布日期 1997.11.26
申请号 KR19940007613 申请日期 1994.04.12
申请人 HYUNDAI ELECTRONICS IND. CO.,LTD 发明人 CHO, CHAN-SUB;KIL, MYUNG-KOON;KOO, YOUNG-MO;KIM, SE-JUNG
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址