发明名称 LEAD FRAME STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a lead frame structure having a group of lead frames having many pieces, whose structure can solve a deformation problem of the lead frame group involved when the lead frame group is cut off from the lead frame structure to thereby obtain a good quality of lead frames without any deformation. SOLUTION: The lead frame structure 1 comprises a plurality of openings 8 made in a metallic plate at predetermined intervals, a group 6 of multiple lead frames 5 made within the openings 8, and bridges 7 for linkedly holding the lead frame group 6 within the openings 8. Material frames 2 are formed independently for the respective openings 8, a plurality of the material frames 2 are linked together by means of linking bridges 3, and easy-to-separate cutout lines 4 are made in the bridges 3 for linking hold of the lead frame group 6 to be extended up to the material frames 2.
申请公布号 JPH09298269(A) 申请公布日期 1997.11.18
申请号 JP19960211242 申请日期 1996.08.09
申请人 TOPPAN PRINTING CO LTD 发明人 SAEKI SHIN;KUNO HISASHI;MORI YUJIRO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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