| 摘要 |
PROBLEM TO BE SOLVED: To provide an aromatic polyimide film which is useful as a base film for a laminate, has satisfactory punchability required especially for lead frame and semiconductor applications, and retains bondability and dimensional stability. SOLUTION: This film is made of a polyimide produced by the reaction of a tetracarboxylic acid ingredient comprising at least 15mol% any one of biphenyltetracarboxylic acid, its dianhydride, and an ester thereof with an aromatic diamine ingredient comprising at least 5mol% phenylenediamine. It has a thickness of 10-125μm, a specific tear strength of 11-22kg/20mm/10μm, and a volatile content of 0.4wt.% or lower. |
