发明名称 WIRE BONDING DEVICE AND WIRE BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To enable highly reliable wire bonding to a lead part by firmly fixing and holding fine and thin inner leads of several hundreds pins of a lead frame and a TAB for high density mounting in a wire bonding device. SOLUTION: In a wire bonding device, a heater block 6 provided with a magnet and a keep jig such as a window clamper 3 consisting of a magnetic material are used. The keep jig is drawn by magnetic force of a magnet of the heater block 6 and is pressed uniformly against a lead frame 4 without being brought into one-sided contact therewith and wire bonding is carried out.
申请公布号 JPH09275121(A) 申请公布日期 1997.10.21
申请号 JP19960084019 申请日期 1996.04.05
申请人 NIPPON STEEL CORP 发明人 ONOE KOZO;TATSUMI KOHEI
分类号 H01L21/60 主分类号 H01L21/60
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