ELECTRONIC DEVICE ASSEMBLY

摘要

In an electronic device assembly, a tape carrier package carries an LSI (Large Scale Integrated Circuit) thereon and has through holes arranged bidimensionally in a film and electrically connected to the LSI by a wiring pattern. An insulating substrate has input/output pins thereon. The input/output pins are connected to pads provided on a mounting substrate, extending throughout and contacting the through holes of the tape carrier package. As a result, the LSI and mounting substrate are electrically connected by the input/output pins. The taper carrier package can be fabricated as inexpensively as the state-of-the-art TBGA which is lower in cost than a similar wiring using a ceramic laminate substrate. Because the dielectric constant and other factors of the material constituting an insulating substrate do not have to be taken into account, there can be used the most inexpensive material.