发明名称 |
METHOD AND DEVICE FOR BONDING A WIRE CONDUCTOR |
摘要 |
The invention relates to a method and device for bonding a wire conductor (13) when producing a transponder unit having a wire-wound coil (12) and a chip unit (15) and arranged on a substrate (11). During a first phase the wire conductor (13) extends across the bonding pad (18, 19) or a region receiving the bonding pad, and is fixed to the substrate (11) in relation to the bonding pad (18, 19) or the region associated with the bonding pad, and during a second phase the wire connector (13) is connected to the bonding pad (18, 19) by connection means (25, 37). |
申请公布号 |
CA2245775(A1) |
申请公布日期 |
1997.08.21 |
申请号 |
CA19972245775 |
申请日期 |
1997.02.12 |
申请人 |
FINN, DAVID;RIETZLER, MANFRED |
发明人 |
FINN, DAVID;RIETZLER, MANFRED |
分类号 |
G06K19/077;H01L21/607;H05K3/10;(IPC1-7):G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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