Semiconductor assembly for a three-dimensional integrated circuit package

摘要

A semiconductor package assembly includes recessed edge portions extending along at least one edge portion of the assembly and an upper surface of leads being exposed therefrom, a top recess portion disposed on a top surface of the assembly, and a bottom recess portion disposed on a bottom surface of the assembly. When the assemblies are used in fabricating a three-dimensional integrated circuit module, the recessed edge portions accommodates leads belonging to an upper semiconductor assembly to achieve electrical interconnection therebetween, the top recess portion and the bottom recess portion belonging to an upper semiconductor assembly form a space to accommodate a heat sink or a capacitor plate.