| 摘要 |
PROBLEM TO BE SOLVED: To achieve an improved bonding without any curling even in a bonding with a relatively long bonding distance regarding a bonding wire used for connecting an electrode and an external lead on a semiconductor element in a semiconductor device. SOLUTION: In a bonding wire W made of an extremely thin metal wire, the extremely thin metal wire is subjected to surface treatment so that an average pull stress which is obtained by dividing the average pull force of a wire being delivered from a capillary 1 at an inclination angle of 70 deg.C or less for the extension line of the center line of the hole of the capillary 1 in a bonding machine by the sectional product of the wire should be equal to or less than 7.0kgf/mm<2> , more preferably 4.5kgf/mm<2> or less. |
