发明名称 Folie oder Band zum Herstellen von elektrischen Verbindungen und Verfahren zum Herstellen einer solchen Verbindung
摘要 <p>A joint forming sheet comprising a substrate having an easy release surface having a contact angle with water of at least 50 DEG , having provided on the easy release surface thereof an inorganic thin layer, the interfacial adhesive force of the inorganic thin layer to the substrate surface being greater than the tensile strength of the inorganic thin layer. The inorganic thin layer can be released and transferred to a part on which an electrical joint is to be formed with high precision to form a joint causing no electrical connection failure. <IMAGE></p>
申请公布号 DE69216010(T2) 申请公布日期 1997.04.03
申请号 DE1992616010T 申请日期 1992.09.02
申请人 NITTO DENKO CORP., IBARAKI, OSAKA, JP 发明人 KAWAZOE, SHOZO, C/O NITTO DENKO CORPORATION, IBARAKI-SHI, OSAKA, JP;OKANO, HIDEHITO, C/O NITTO DENKO CORPORATION, IBARAKI-SHI, OSAKA, JP
分类号 B32B15/08;H01B17/56;H01L21/60;H01R4/04;H01R9/03;H01R43/00;H01R43/02;H05K3/34;H05K3/40;(IPC1-7):H01R4/04 主分类号 B32B15/08
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