| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive agent for a semiconductor device, which excels in heat resistance and has a small coefficient of moisture absorption by incorporating a polyquinoline resin or a polyquinoxaline resin in an adhesive agent layer. SOLUTION: A polyquinoline resin expressed by a formula I and a formula II or a polyquinoxaline expressed by a formula III and a formula IV is contained in an adhesive agent. R<1> and R<2> respectively independently exhibit an alkyl group, an aryl group, an alkoxy group, an allyloxy group, a formyl group, a ketone group, an ester group, an amide group, a heteroaryl group, a cyano group or a bivalent hydrocarbon group which can contain an unsaturated linkage formed by connecting together two groups, where R<3> C to R<9> exhibit a hydrogen atom, the alkyl group, the aryl group or the heteroaryl group, m and n are integers of 0 to 5, and X is nil (a chemical linkage). Z<1> and Z<2> are nil respectively (a chemical linkage) or exhibit an arylene group, and Y is a polyquinoline resin. Therefore, the foaming due to hygroscopic moisture can be reduced. |
