| 摘要 |
<p>The invention relates to an apparatus for supplying thermosetting resin through at least one conduit into a mould cavity being under vacuum and partially filled with reinforcing material from below and upwards for producing elongated objects with relatively small wall thickness, the mouth of said at least one conduit is placed intially at the lowest end closure of the cavity and is then successively moved upward in a position just under the surface of the introduced resin. Said at least one conduit is according to the invention an elongated, thin pipe or cannula, preferably of metal, for producing molecular friction in the resin during the transportation of the same through the pipe at the pressure used and thereby reduce the visocisty of said resin.</p> |
