| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device on which a cavity area is decreased by a method wherein a cavity is provided on the circuit board such as a printed wiring board, etc., and a semiconductor element is buried in the cavity. SOLUTION: An extension corner 17, which is swelled out, is provided on the corner part of a cavity 16 where a semiconductor element 12 is buried in the circuit board 11 such as a printed wiring board, etc. By providing the extension corner 17, the space dimensions of the semiconductor element 12 on the circumferential part of the cavity 16 can be suppressed, and the area of the cavity 16 can be reduced synthetically. As a result, board cost and mounting cost can be cut down, and at the same time, the degree of freedom in layout of the wiring conductor 13 on the circumference of the semiconductor element 12 can be increased. |
