| 摘要 |
In the printer head of this invention, the base component 1 and the lid component 5 can be easily bonded without clogging the groove 2 that serves as the ink flow channel. The eutectic alloy layer 3 is formed by a eutectic reaction on the bonding surface between the base component 1 having the groove 2 composed of silicon formed thereon and the lid component 5 having the thin gold film 4 formed thereon. Therefore, the base component/and the lid component 5 are bonded to each other.
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