| 发明名称 |
Thick film conductive paste composition |
| 摘要 |
<p>This invention is directed to a thick film conductive paste composition comprising conductive paste, polymer binder and at least one organic additive being selected form the group of amidosulfuric metallic salt, higher fatty acid metallic salt and metal resinate utilized for forming termination of chip resistor without an occurrence of swelling and/or cracks in the superimposed area of the termination and resistor. <IMAGE></p> |
| 申请公布号 |
EP0747912(A2) |
申请公布日期 |
1996.12.11 |
| 申请号 |
EP19960108829 |
申请日期 |
1996.06.03 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
INABA, AKIRA;KUNO, HIDEOKI |
| 分类号 |
H05K1/09;H01B1/16;H01C1/142;H01C7/00;H01C10/30;H01C17/065;(IPC1-7):H01C17/065 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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