| 摘要 |
<p>PURPOSE: To provide a semiconductor module for microprocessors, which is excellent in heat radiation and can mount ball grid '1 array packages. CONSTITUTION: A plastic grid array 2 having pins i.e., mounting terminals onto an interconnection board at the lower face, has a through-hole 2a and Cu plate 3 is mounted to cover the top face of the hole 2a. On the lower face of the plate 3 a microprocessor semiconductor element 1 is mounted and connected to the array 2 by Au wires 4. On the top face of the array 2 a plurality of cache memories 7 of a ball grid array package are mounted. On the top face of the plate 3 a heat sink 8 is laid with adhesives.</p> |
