| 摘要 |
PURPOSE: To provide a method for manufacturing a low-cost high density printed circuit board having high yield and a blind viahole. CONSTITUTION: A copper-clad multilayer insulating board 1 formed with a circuit is coated with photosensitive curable epoxy resin, exposed and developed via a blind viahole forming mask film, and the resin of a predetermined position is removed to form an insulating layer 3. Then, after a through hole is opened, the layer 3 is roughed, manganese dioxides are formed on the entire front and rear surfaces of the board 1, dipped in pyrrole solution to form a conductive film 7 made of polypyrrole derivative. Further, alkali developing type plating resistant dry films are laminated on the entire front and rear surfaces of the board 1 to form plated resist patterns via plating resist forming mask films. Thereafter, electrolytic copper plated to form a conductor layer 7, then plating resist is removed, and further the exposed film 7 is dissolved to be removed. |
