| 摘要 |
PURPOSE: To separate microscopic particles adhering to electronic component chips from the chips and to prevent the jam of the chips on a component transfer path, which is caused by the adhesion of the microscopic particles or the like. CONSTITUTION: A plate 24 having a multitude of pores and a disposal space 26, which is positioned under the lower part of the plate, are formed under the lower part of a prescribed place on a chute 13 as separation means for separating microscopic particles adhered to electronic component chips 12 from said electronic component chips. |
