| 摘要 |
<p>PURPOSE: To provide a method for manufacturing a split block mold joint in which the shape disorder of an external semiconductive layer formed on the periphery of a reinforcing insulator can be avoided. CONSTITUTION: After the central conductors 5 of CV cables 1a, 1b are electrically connected to each other, a pair of split-insulator are so mounted as to sandwich the connector to form a reinforcing insulator 2. Then, a shrinkage tube 3 is engaged with the outside of the insulator 2, disposed and added with heat. Thus, the tube 3 is shrunk, and brought into close contact with the periphery of the insulator 2. Then, an external semiconductive layer 4 is formed on the periphery of the tube 3.</p> |
