| 摘要 |
A quartz glass jig for heat-treating semiconductor devices comprising silicon wafer resting members having quartz glass boards in and along which wafer resting positions formed by laser beam machining. No microcrack on the wafer resting members of a quartz glass jig for heat treating silicon semiconductor devices occurs and contamination by impurities is prevented and thus favorable heat treatment of the silicon semiconductor devices is performed when the jig is used. A combinational jig for heat treatment of silicon wafers comprises a resting member and a base member for supporting the resting member. Both resting member and base member are made of quartz glass and combined together via a silicon member. Also, a method of fabricating the combinational jig is disclosed. The novel combinational jig for heat treatment of silicon wafers can effectively prevent contamination of silicon wafers, especially contamination due to movement of sodium element, and thus the combinational jig provides high-quality silicon wafers. |
