Resin sealing method and device.

摘要

To reduce the amount of resin used in resin sealing in order to reduce the costs of the resin sealing process. Structure An upper die (100) and lower die (102) are placed together to form a resin sealing package die (103), on the seam of which the following are situated: a number of cavities (104) each of which is capable of holding a single semiconductor chip (CP) attached to a lead frame (LF); a pot bottom (110) that serves to press a thermosetting molding compound (resin) (12) by means of the pressing force of a pressing member such as a flange (108); and runners (114) that serve to feed the resin from the aforementioned pot bottom (110) to the individual cavities (104). To the tip of the flange (108) is attached a flexible member that is capable of contracting in the pressing direction of the aforementioned flange (108) and simultaneously expanding in the direction perpendicular to the aforementioned pressing direction, while maintaining a nearly constant volume according to the pressure applied from the aforementioned flange (108). For example, this may be a cylindrical or disk-shaped flexible unit (10) which consists of silicone rubber.