发明名称 RESIN SEALING APPARATUS AND METHOD
摘要 PURPOSE:To enhance the coefficient of utilization of a resin without sacrifying the flow of the resin. CONSTITUTION:A gas passage 11 for sending gas into a mold hermetically closed from the outside is provided to a resin sealing mold 1 and a plunger head 3 and a resin 10 is injected into a cavity 8. Other wise, the bottom surface of a runner 6 is constituted of an up and down drivable runner part lower mold and, after the resin 10 is sent into the runner 6 by the plunger head 3, the runner part lower mold is raised to inject the resin 10 sent into the runner 6 into the cavity 8.
申请公布号 JPH07290487(A) 申请公布日期 1995.11.07
申请号 JP19940084235 申请日期 1994.04.22
申请人 NEC CORP 发明人 SAKAZAKI ATSUSHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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