发明名称 Apparatus for troubleshooting photoimage plating problems in printed circuit board manufacturing.
摘要 <p>An apparatus and method are disclosed for testing electrodeposition processes used in printed circuit board manufacture. The apparatus, having a photoresist pattern on a test printed circuit board, for use in a Hull Cell to determine efficiency, uniformity, and interactions of the process on the surface of the printed circuit board in order to provide for design rules and process specifications.</p>
申请公布号 EP0395245(B1) 申请公布日期 1995.09.06
申请号 EP19900303721 申请日期 1990.04.06
申请人 HEWLETT-PACKARD COMPANY 发明人 ROHLEV, SLAV A.
分类号 G01N27/416;C25D7/00;G01N27/26;G03F7/26;H05K3/18;H05K3/24;(IPC1-7):H05K3/00;C25D17/00;H05K13/08 主分类号 G01N27/416
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