| 摘要 |
PURPOSE:To form a resist film excellent in heat resistance, chemical resistance shock resistance, and solder metal plating performance by using a specified photopolymerization resin composition. CONSTITUTION:Vinyl resin having 0.3-10mol polymerization unsaturated group and 0.1-3mol aprotic sulfonlum salt containing group expressed by the following formula in 1kg of resin and a photopolymerization initiator are used as essential components. In the formula, R1 indicates a hydroxyl group, an alkoxy group, an ester group or the lke, R2 and R3 are the same or different and indicate an organic group with the carbon number of 1-14. R2 and R3 may form a heterocycle together with a sulfur atom to which R2 and R3 are coupled. By using the above resin composition, a film excellent in adhesive property to the base material, heat resistance, chemical resistance, and shock resistance can be formed. |
