发明名称 |
Photosensitive composition and resin-encapsulated semiconductor device. |
摘要 |
<p>A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist. <IMAGE></p> |
申请公布号 |
EP0431971(B1) |
申请公布日期 |
1995.07.19 |
申请号 |
EP19900313342 |
申请日期 |
1990.12.07 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAYASE, RUMIKO, C/O INTELLECTUAL PROPERTY DIVISION;OBA, MASAYUKI, C/O INTELLECTUAL PROPERTY DIVISION;KIHARA, NAOKO, C/O INTELLECTUAL PROPERTY DIVISION;MIKOGAMI, YUKIHIRO, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
G03F7/075;H01L21/312;H01L23/29;(IPC1-7):G03F7/075 |
主分类号 |
G03F7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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