| 摘要 |
PURPOSE:To obtain a multilayered printed wiring board excellent in drill workability and characteristic impedance without deteriorating heat resistance and other various characteristics, by defining the diameter and the average length of glass fiber used as filler in resin paste. CONSTITUTION:In resin paste which is buried in the uneven part between the copper foil etching part of an inner layer circuit board and the additive inner layer circuit and flattens the part, glass fiber whose diameter is 2-10mum and whose average fiber length is 5-40mum is used as filler. The content of glass fiber is preferably 10-150wt.% to resin of 100wt.%. polyaminobismaleimide resin, epoxy resin, phenolic resin, etc., are applied to the resin used in the resin paste. E glass fiber, D glass fiber, S glass fiber, etc., which are applied to the above glass fiber are ground by a Henschel mixer or the like, and the average fiber length is adjusted. |
