| 摘要 |
PURPOSE:To provide a heat-resistant and heat conductive packing, excellent in heat resistance for a long period and insulating properties and useful for releasing the heat thereof to the outside by bringing thereof into close contact with an exothermic electronic apparatus, etc., by filling a prescribed amount of a heat conductive filler in a polyether ether ketone resin. CONSTITUTION:This heat-resistant and heat conductive packing is obtained by filling (B) 30-60vol.% heat conductive filler such as silica or alumina in (A) 40-70vol.% polyether ether ketone resin, providing a heat conductive sheet 1 and applying a heat-resistant adhesive 2 such as a polyimide-based adhesive to one or both surfaces of the resultant heat conductive sheet 1. |
