Through backplane impingement cooling apparatus

摘要

The present invention relates to an apparatus for providing a cooling system for electrical components mounted to the opposite side of a backplane from that on which the cooling air is dispersed. The invention of the present application accomplishes this cooling by providing for siphoning a portion of the cool air from the air plenum, directing it up a duct, and delivering it through a series of apertures onto the component which requires cooling on the back side of the backplane. The apertures include one through the backplane which is homologously positioned with respect to the electrical component on the back side of the backplane.